One component, heat cured epoxy system for bonding, sealing, dam-and-fill applications. Resists temperatures up to +600°F. Thermally conductive, electrically insulating.
Two Component, Room Temperature Curable Epoxy Adhesive, Sealant, Coating and Encapsulating System, Featuring Outstanding Chemical Resistance to Solvents, Alcohols and Fuels.
Two Component, Room Temperature Curable Epoxy Adhesive, Sealant, Coating and Encapsulating System, Featuring Outstanding Chemical Resistance to Solvents, Alcohols and Fuels.
One Component, Heat Curing, High Purity Nickel Conductive Epoxy Adhesive/Sealant Featuring Both High Shear and High Peel Strength for Performance up to 400°F
