Expanded Product List
Master Bond Product Search
626 products match
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FLM36-LO NASA low outgassing approved B-stage epoxy adhesive. Tough and flexible. Elongation is greater than 50%. Thermally conductive/electrically insulative. Withstands rigorous thermal cycling. Can be die cut into custom shapes. Squeeze out is minimal. Ideal for applications requiring precise bond lines. Resists up to +500°F. |
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LED401 One part, no mix, fast curing compound. Tack free cure. High bond strength to a wide range of substrates. Solvent free formulation. Withstands 1,000 hours 85°C/85% RH. Serviceable from -60°F to +250°F. |
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LED401 White High viscosity, one component system in white. Excellent dimensional stability, electrical insulation properties and good chemical resistance upon cure. Serviceable from -60°F to +250°F. |
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LED401LV One part, low viscosity, optically clear system. Fast curing with a high bond strength. Superior dimensional stability and electrical insulative properties. Serviceable from -60°F to +250°F. |
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LED403Med One part, high viscosity system. Cures tack-free without any oxygen inhibition. Meets USP Class VI specifications; also passes ISO 10993-5 cytotoxicity test. Resists gamma radiation, EtO and various chemical sterilants. Serviceable from -60°F to +250°F. |
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LED405FL3 Fast cures under LED light. Outstanding optical clarity, with fluorescent dye. Can be used for small potting and encapsulation, as it can cure up to 1/8 inch thick. Withstands rigorous thermal cycling, mechanical shock and vibration. Serviceable from -100°F to +250°F. |
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LED405Med One part, cures tack-free without any oxygen inhibition. Passes ISO 10993-5 cytotoxicity test. Serviceable from -60°F to +250°F. Superb optical clarity. |
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LED415DC90 |
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LED415DC90Med |
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LED422DC90 |